ITI Dicing Blades, Fine-Grinding Plates

Diamond Blades and Wheels	Backgrinding Wheels	Fine Grinding (Fixed Abrasive) Plates
Hubs, Arbors and Spacers	Dressing Boards and Sticks	Grinding Wheels

ITI Solutions

BGA (Ball-Grid Array) QFN (Quad Flat No Lead) LED (Light-Emitting Diode) CMOS (Complementary Metal-Oxide Semiconductor) DWDM (Dense Wavelength Division Mulitplexing) Filters HDD (Hard Disk Drive) Semiconductor Wafer Metal Powder parts (MP) Seal Rings Stamped Components Inserts Shear Slitter Knives

7/13/2010

SEMICON West: Moscone Center, San Francisco
July 14th To July 16th, 2010

Featuring the new RQP series diamond blades for QFN applications.
The RQP series provides extremely long life with outstanding cut quality.

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