Dicing Blades

Dicing Blades and Wheels

Including metal bond dicing blades, resinoid dicing blades, hybrid dicing blades and electroplated dicing blades, ITI's precision dicing blades are manufactured for mounting to hubs and arbors on special saw machines for precision singulating, slicing, dicing and slotting semiconductor components, hard disk drive heads, precision glass components, etc. These dicing blades can be as thin as 0.002” (50 microns), and the dicing blades range in size from 0.5” to 8” O.D. (12mm to 200mm).

Dicing Blade Brochure Return To Product List

Metal & Resin Bond Dicing Blades

Applications: Used for precision singulating, slicing, dicing, and slotting:

BGA, CSP, and other chip carrier packages
Glass for optics and photonics
Discrete electronic components, such as MLCC (Multi-layer ceramic capacitors)
Thin-film disk drive heads
Ceramic
Steels
Ferrite
PZT

PDF Brochures:

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ITI Capabilities:

In-house test cutting and process development lab
Rapid delivery times
Over 20 years experience producing diamond blades in-house
Over 2 million diamond blades produced

Features:

Standard and custom blade formulations
Resin and metal bonded (sintered) blades
Diamond or CBN abrasive
Super-tight tolerances available

Available sizes range from .5 inches to 8 inches OD (12mm to 200mm). Bonded blades as thin as 0.002 inches (50 microns).

Available tolerances as tight as 1 micron on thickness, 2 microns on parallelism.

Engineered Solutions

ITI has standard blades available for many applications and all brands of sawing and dicing machines. In addition, ITI can custom formulate blades for your specific application to maximize throughput and cut quality. Blade life can be enhanced by as much as four times that of conventional blades.

ITI blades are fabricated with the highest quality diamond, CBN and bond powders available. Critical properties such as friability, size, shape, concentration, and bond strength are all carefully considered during the design to ensure optimized performance.

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