ITI :: Dicing Blades

	Diamond Blades and Wheels Mounted to hubs and arbors on special saw machines for precision singulating, slicing, dicing and slotting semiconductor components, hard disk drive heads, precision glass components, etc. These products can be as thin as 0.002” (50 microns), and range in size from 0.5” to 8” O.D. (12mm to 200mm).
	Dicing Blade Brochure Return To Product List

Resin & Metal Bond Dicing Blades

Applications: Used for precision singulating, slicing, dicing, and slotting:

BGA, CSP, and other chip carrier packages
Glass for optics and photonics
Discrete electronic components, such as MLCC (Multi-layer ceramic capacitors)
Thin-film disk drive heads
Ceramic
Steels
Ferrite
PZT

PDF Brochures:

Please Contact Us for additional information

ITI Capabilities:

In-house test cutting and process development lab
Rapid delivery times
Over 20 years experience producing diamond blades in-house
Over 2 million diamond blades produced

Features:

Standard and custom blade formulations
Resin and metal bonded (sintered) blades
Diamond or CBN abrasive
Super-tight tolerances available

Available sizes range from .5 inches to 8 inches OD (12mm to 200mm). Bonded blades as thin as 0.002 inches (50 microns).

Available tolerances as tight as 1 micron on thickness, 2 microns on parallelism.

Engineered Solutions

ITI has standard blades available for many applications and all brands of sawing and dicing machines. In addition, ITI can custom formulate blades for your specific application to maximize throughput and cut quality. Blade life can be enhanced by as much as four times that of conventional blades.

ITI blades are fabricated with the highest quality diamond, CBN and bond powders available. Critical properties such as friability, size, shape, concentration, and bond strength are all carefully considered during the design to ensure optimized performance.

English 中文（简体）中文（繁體）