ITI :: Backgrinding Wheels

	Backgrinding Wheels Used on backgrinding machines for thinning and flattening silicon wafers, glass products, ceramic products. Sizes range from 8” to 14” O.D.
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Used on backgrinding machines for thinning and flattening silicon wafers, glass products, ceramic products. Sizes range from 8” to 14” O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and others.
Bonds and diamonds optimized for your application. Many variations of resin, vitrified and metal (sintered) bonds are available, with a wide range of diamond sizes, types and concentrations. Contact Us for information about a wheel designed for your application.

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