ITI Dicing Blades, Fine-Grinding Plates

Dicing Blades
Backgrinding Wheels
Fine Grinding Plates
Hubs, Arbors, Spacers
Dressing Boards & Sticks
Grinding Wheels
Slitter Knives
Concrete Grinding
Stone Tools

Diamond Blades and Wheels	Backgrinding Wheels	Fine Grinding (Fixed Abrasive) Plates
Hubs, Arbors and Spacers	Dressing Boards and Sticks	Grinding Wheels

ITI Solutions

BGA (Ball-Grid Array) QFN (Quad Flat No Lead) LED (Light-Emitting Diode) CMOS (Complementary Metal-Oxide Semiconductor) DWDM (Dense Wavelength Division Mulitplexing) Filters HDD (Hard Disk Drive) Semiconductor Wafer Metal Powder parts (MP) Seal Rings Stamped Components Inserts Shear Slitter Knives

7/14/2009

SEMICON West: Moscone Center, San Francisco
July 14th To July 16th

Featuring the new RQP series diamond blades for QFN applications.
The RQP series provides extremely long life with outstanding cut quality.

Come visit us in South Hall at booth #334 (next to TechXPOT).

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9/30/2009

Semicon Taiwan: World Trade Center, Taipei
Sept. 30th to Oct. 2nd

Featuring our new RQP series QFN blade solution. Come visit our booth.

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